Cleanroom laboratory
The Department of Automation Science and Technology has a small cleanroom laboratory for manufacturing microsensor prototypes. The size of the cleanroom is 22 m2 and the cleanroom classification is ISO 7 (10000).
Processes:
• Photolithography
• Wet etching
• Reactive ion etching and plasma treatments
• Dicing and bonding
• Optical and atomic force microscopy
• Copper electroplating
Contact persons:
Tomi Ryynänen
Markus Karjalainen
Jouni Niemelä
Jukka Lekkala
Equipment:
- Karl-Süss MJB 3 mask aligner
- 365 nm contact exposure
- ~1 µm resolution with chrome masks
- >=20 µm features with film mask
- 3”-4” mask size
- Max 3” wafer size
- Digital exposure device
- Mask free micropatterning method
- Rapid prototyping in one day
- ~10 µm resolution (1024 x 768 pixels exposed on area of 1.2 x 0.9 cm
- Advanced Vacuum Vision 320 Mk II RIE
- Dry etching of Si, SiO2, Si3N4, polymers, Ti, etc.
- Isotropic or directional etch profile
- O2 plasma cleaning
- Plasma treatment prior PDMS to glass bonding
- Five gases:
– Tetrafluoromethane (CF4)
– Trifluoromethane (CHF3)
– Sulphur hexafluoride (SF6)
– Argon (Ar)
– Oxygen (O2)
- Laurell WS-400 spinner
- Programmable
- Manual dispensing
- 100-6000 rpm
- Kojair VKV-15FE fume hood
- N2 gun
- Qteck 3000 ultrasonic bath
- Bath volume 3 l
- Ultrasound power 160 W
- Ultrasound frequency 35 kHz
- Heater, max 80 °C
- Timer 1-60 min
- Millipore Direct-Q 3 water purification system
- Resistivity 18.2MΩ
- 0.6 l/min
- VWR 815-HPS stirrer/hotplate
- Max 400°C
- 60-1600 rpm
- Temperature probe
- Zeiss Axio Imager.A1m microscope
- Max 500 x magnification
- DIC prism
- Camera adapter
- Dark field / bright field
- MTI EC400 dicing saw
- Programmable
- Saw accuracy 0.01mm
- Blade thickness 0.3mm
- TPT HB-05 wirebonder
- Ball and wedge bonding
- Flip-chip bumps
- 25 µm Au and Al wires
- Wyko NT1100 optical profilometer
- High resolution 3D surface measurements from sub-nanometer roughness to millimeter-high steps
- Located in ORC
- Park Systems XE-100 AFM
- Scan range (XY): max 50 x 50 µm
- Scan range (Z): max 12 µm
- Image size: typical 256 x 256 pixels,
- max 4096 x 4096 pixels
- Working range of XY stage 25 x 25 mm
- Max sample size: 100 mm x 100 mm x 20 mm, 500 g
- Non-contact, contact and tapping modes
- Electric and magnetic force modes
- Liquid cell and electrochemistry packages
- Located in BME
Links:
COFA
FindNano
RIE homepage (requires password)