About LASEAL project

The goal of the poject is to assess the feasability of the laser assisted chip and wafer-level packaging processes for sealing and electrical contacting and for hermetic sealing in reduced pressure in real microsystem applications.

Laser technologies to be applied:

• Picosecond pulse laser at 1.06 µm - direct bonding, metal bonding
• Nanosecond pulse laser at 1.55 µm - metal bonding

Device packaging specifications that we aim to meet are:

• Low process temperature during packaging, down to 30°C
• Hermetic packaging in reduced pressure, preferably in vacuum (0,1 mbar)
• Low stress
• Bonding without additional sealing materials to extend devices shelflife (e.g. operation in high T)
• Negligible contact resistance
   

Partners:

TUT, Department of Production Engineering
VTI
Okmetic
Solarprint
VTT
LUT