Cleanroom laboratory

The Department of Automation Science and Technology has a small cleanroom laboratory for manufacturing microsensor prototypes. The size of the cleanroom is 22 m2 and the cleanroom classification is ISO 7 (10000).

Processes:
• Photolithography
• Wet etching
• Reactive ion etching and plasma treatments
• Dicing and bonding
• Optical and atomic force microscopy
• Copper electroplating

Contact persons:
Tomi Ryynänen
Markus Karjalainen
Jouni Niemelä
Jukka Lekkala

Equipment:

- Karl-Süss MJB 3 mask aligner

• 365 nm contact exposure
• ~1 µm resolution with chrome masks
• >=20 µm features with film mask
• 3”-4” mask size
• Max 3” wafer size

- Digital exposure device

• Mask free micropatterning method
• Rapid prototyping in one day
• ~10 µm resolution (1024 x 768 pixels exposed on area of 1.2 x 0.9 cm

- Advanced Vacuum Vision 320 Mk II RIE

• Dry etching of Si, SiO2, Si3N4, polymers, Ti, etc.
• Isotropic or directional etch profile
• O2 plasma cleaning
• Plasma treatment prior PDMS to glass bonding
• Five gases:

– Tetrafluoromethane (CF4)
– Trifluoromethane (CHF3)
– Sulphur hexafluoride (SF6)
– Argon (Ar)
– Oxygen (O2)

-  Laurell WS-400 spinner

• Programmable
• Manual dispensing
• 100-6000 rpm

- Kojair VKV-15FE fume hood

• N2 gun

- Qteck 3000 ultrasonic bath

• Bath volume 3 l
• Ultrasound power 160 W
• Ultrasound frequency 35 kHz
• Heater, max 80 °C
• Timer 1-60 min

- Millipore Direct-Q 3 water purification system

• Resistivity 18.2MΩ
• 0.6 l/min

- VWR 815-HPS stirrer/hotplate

• Max 400°C
• 60-1600 rpm
• Temperature probe

- Zeiss Axio Imager.A1m microscope

• Max 500 x magnification
• DIC prism
• Camera adapter
• Dark field / bright field

- MTI EC400 dicing saw

• Programmable
• Saw accuracy 0.01mm
• Blade thickness 0.3mm

- TPT HB-05 wirebonder

• Ball and wedge bonding
• Flip-chip bumps
• 25 µm Au and Al wires

- Wyko NT1100 optical profilometer

• High resolution 3D surface measurements from sub-nanometer roughness to millimeter-high steps
• Located in ORC

- Park Systems XE-100 AFM

• Scan range (XY): max 50 x 50 µm
• Scan range (Z): max 12 µm
• Image size: typical 256 x 256 pixels,
• max 4096 x 4096 pixels
• Working range of XY stage 25 x 25 mm
• Max sample size: 100 mm x 100 mm x 20 mm, 500 g
• Non-contact, contact and tapping modes
• Electric and magnetic force modes
• Liquid cell and electrochemistry packages
• Located in BME

Links:
COFA
FindNano
RIE homepage (requires password)